fastRise™
Lowest loss non-reinforced prepreg
fastRise™ is designed to bond all manner of circuit boards together with the lowest possible loss of any thermosetting prepreg available today. fastRise™ enables 77 GHz automotive radar. fastRise™ is nonreinforced and eliminates skew/ variation in high speed digital/RF circuits. fastRise™ can be foil laminated, laser ablated, and sequentially laminated to yield layers of stacked or staggered microvias. The low 420°F lamination temperature enables 5+ sequential laminations at temperatures lower than those normally used for FEP and PFA in military constructions. The fastRise family, including fastRise™ FR-EZ and EZpure, bonds well to PTFE, epoxy, low-flow epoxy, LCP, polyimide, and hydrocarbon materials.
| Product Name | Description | DK | DF | TG (° C) | TC (W/mK) | IPC Slash Sheet |
|---|---|---|---|---|---|---|
| fastRise FR-25-0021-45 | Lowest loss non-reinforced prepreg | 2.43 | 0.0012 | 188 | 0.25 | 4103/520 |
| fastRise FR-25-0021-45F | Lowest loss low flow non-reinforced prepreg | 2.45 | 0.0012 | 188 | 0.25 | 4103/520 |
| fastRise FR-27-0040-43F | Lowest loss non-reinforced prepreg | 2.77 | 0.0014 | 188 | 0.25 | 4103/530 |
| fastRise FR-28-0040-50 | Lowest loss non-reinforced prepreg | 2.76 | 0.0014 | 188 | N/A | 4103/530 |
| fastRise FR-7 | High DK, low loss glass reinforced prepreg | 7.45 | 0.0034 | 200 | 0.43 | 4103/570 |
| fastRise FR-EZ-22P | Low Temperature Curing, Flexible Prepreg/Bondply | 2.40 | 0.0018 | N/A | 0.33 | 4203B/26 |
| fastRise FR-EZ-33P | Low Temperature Curing, Flexible Prepreg/Bondply | 2.50 | 0.0024 | N/A | 0.33 | 4203B/26 |
| fastRise FR-EZpure | Low temperature curing, thermosetting prepreg | 2.8 | 0.0032 | 168 | 0.33 | 4103/530 |