Newsroom
Company, Product, Event, and Industry News and Press
AGC Multi Material America will participate in ECTC2023 in Orlando, USA on May 30-June 2, 2023
AGC Multi Material America will participate in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC2023) on May 30-June 2, 2023, in Orlando, Florida, USA.
ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials, and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
In this conference, our company will make a presentation titled Properties of Low Dielectric Constant Buildup Materials Containing Micron Sized Hollow Silica.
We are looking forward to meeting you in ECTC2023.