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AGC Multi Material is highlighting their range of substrate materials at DesignCon 2025
AGC Multi Material America (AMMA) is participating in the DesignCon exhibition in Santa Clara, CA on January 28 – January 30, 2025.
Visit us at Booth 1238 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series. Learn more at our website agc-multimaterial.com.
DesignCon is the premier high-speed communications and system design conference and exposition.
We are looking forward to meeting you!