Solutions » EZ-IO-F
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Thermally stable composite based on nanotechnology, spread weave and PTFE
EZ-IO-F is a thermally stable composite based on nanotechnology, spread weave and PTFE. Nanoparticle silica insures a drill quality on par with FR4 materials. EZ-IO-F is based on a very low (~10 wt%) fiberglass content. The nature of the spread weave provides a uniform dielectric constant and impedance as suggested by skew testing. EZ-IO-F was created for the next generation of digital circuitry where digital transmission speeds start at 25 gbps and reach 112 gbps. EZ-IO-F was also designed for microwave applications operating at increasingly higher frequencies where there is a need to combine both digital and microwave circuitry onto one PWB. EZ-IO-F was developed to challenge the best FR4 materials at the fabricator level in the most difficult 30-40 layer digital applications.
Additional Information
| EZ-IO-F |
| 2.80 +/- 0.05 |
| 0.0015 |
| Download (817.10KB) |
| Download (260.19KB) |
Description
- Thermally stable composite based on nanotechnology, spread weave and PTFE
Benefits
- Extremely low skew
- Nanotechnology based PTFE laminate
- Drill quality of FR4 (1000+ hits/bit)
- Registration of FR4
- Extremely low fiberglass content (~10 %)
- <0.18 % DK variation within a lot
- Temperature stable DK
- Capable of 40+ layer large format PWBs
- CAF Resistant
Application
- Semiconductor testing at 25 gbps and higher/Test and measurement/Optical data transport & backplane routers/Hybrid FR4 PWBs combining microwave & Digital signals/Avonics and aerospace