Solutions » fastRise FR-28-0040-50
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Lowest loss non-reinforced prepreg
fastRise™ is designed to bond all manner of circuit boards together with the lowest possible loss of any thermosetting prepreg available today. fastRise™ enables 77 GHz automotive radar. fastRise™ is nonreinforced and eliminates skew/ variation in high speed digital/RF circuits. It is based on ceramic, thermoset and PTFE resin, and is ideal for use with AGC's TSM-DS3, TSM-DS3b, TSM-DS3M and EZ-IO-F. fastRise™ can be foil laminated, laser ablated, and sequentially laminated to yield layers of stacked or staggered microvias.
Additional Information
| fastRise FR-28-0040-50 |
| 2.76 |
| 0.0014 |
| Download (529.75KB) |
| Download (2.21MB) |
Description
- Lowest loss non-reinforced prepreg
Benefits
- DF = 0.0014 / 0.0017 (10/40 GHz)
- Laser ablatable, HDI ready
- Low Dk enables reduced thickness of ATE boards
- Low temperature alternative to thermoplastic films in avionics and aerospace designs
- Multilayer prepreg for high layer count high speed digital
- Stable Dk over temperature
- Fiberglass free prepreg
- Enables 5+ sequential laminations
- Compatible with conductive pastes between subassemblies
Application
- Filters & Couplers
- Avionics and Aerospace
- Automotive Radar
- Beam Steerable Antenna
- Flexible Circuits