Solutions » fastRise FR-7
The AGC Solution Guide lets you choose the most suitable product for your intended application.
High DK, low loss glass reinforced prepreg
fastRise™ 7 is a thermally stable, high DK (7.45 at 10 GHz), low loss prepreg designed to enable the manufacture of high dielectric constant stripline structures at low temperatures. fastRise™ 7 prepreg enables stripline manufacture at 420 °F (215 °C), well below the fabrication temperatures of Low Temperature Co-fired Ceramics (LTCC)
Additional Information
| fastRise FR-7 |
| 7.45 |
| 0.0034 |
| Download (368.06KB) |
Description
- High DK, low loss glass reinforced prepreg
Benefits
- High 7.45 DK organic prepreg
- Low ( 420 °F/215 °C) lamination enables conventional PWB fabrication
- Lower cost / reduced weight alternative to LTCC
- Lower cost alternative to fusion bonding
- Enables miniaturization & densification of high DK RF stripline structures
- Compatible with Ticer/Ohmega resistor foils
Application
- Avionics and Aerospace (weight reduction)
- Radar Manifolds, Antennas, Fire control
- Filters, Couplers, Power Amplifiers
- Phase Matching Networks