Solutions » fastRise FR-EZ-22P
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Low Temperature Curing, Flexible Prepreg/Bondply
fastRise™ EZ is a low temperature curing, low-loss flexible prepreg/bondply designed to improve the manufacturability of complex rigid/flex PWBs containing polyimide, LCP, or PTFE cores. fastRise EZ’s low loss enables the design of flexible high speed cables and rigid RF/digital multilayers without the uncertainties and costs associated with high temperature laminations.
Additional Information
| fastRise FR-EZ-22P |
| 2.40 |
| 0.0018 |
| Download (526.08KB) |
| Download (192.69KB) |
Description
- Low Temperature Curing, Flexible Prepreg/Bondply
Benefits
- FR4 lamination temperatures
- Low DK enables reduced PWB thickness for the same impedance
- Thermosetting prepreg will not reflow
- Fiberglass-free prepreg;Compatible with conventional lamination processes
- Can be combined with any core material
- Laser Ablatable
Application
- High Speed Flex Cables
- Thin Multilayers
- ATE testing
- mmWave Antenna/Automotive