Solutions » N7000-3F
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Toughened Polyimide UL 94 V-1
N7000-3F is a next-generation high-Tg polyimide using a toughened, filled resin chemistry. The product meets UL 94-V1 designation. N7000-3F is designed to prevent cracking when filling etched areas in polyimide multilayers that contain heavy copper. This advanced material is designed for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability. This polyimide also meets NASA requirements for no visible bromine.
Additional Information
| N7000-3F |
| 4.0 |
| 0.014 |
| Download (354.35KB) |
| Download (320.90KB) |
Description
- Toughened Polyimide Laminate PCB Material
- Rigid Laminate (>= 0.020) N7105-3F
- Thin Laminate (< 0.020) N7205-3F
- Prepreg N7305-3F
Benefits
- Polyimide Resin Chemistry
- Robust Thermal Stability and Reliability
- High Temp Tolerance and Chemical Resistance
- Designed for Use in Severe Conditions
Application
- Backplanes
- Fine-Line, Surface-Mount and BGA Multilayers
- Avionics
- Down-well Petroleum
- Burn-in Boards