Solutions » TSM-DS3
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Dimensionally stable low loss laminate
TSM-DS3 is a thermally stable, industry leading low loss core (DF = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers. TSM-DS3 was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
Additional Information
| TSM-DS3 |
| 3.0 +/- 0.05 |
| 0.0014 |
| Download (455.60KB) |
| Download (2.06MB) |
Description
- Dimensionally stable low loss laminate
Benefits
- Industry best DF (DF: 0.0011 @ 10GHz)
- High thermal conductivity
- Low (~5 %) fiberglass content
- Dimensional stability rivals epoxy
- Enables large format high layer count PWBs
- Builds complex PWBs in yield with consistency and predictability
- Temperature stable DK +/- 0.25 (-30 ° to 120 °C)
- Compatible with resistor foils
Application
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antennas
- Oil Drilling
- Semiconductor / ATE Testing