Solutions » TSM-DS3M
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Dimensionally stable low loss laminate
TSM-DS3M is a thermally stable, industry leading low loss core (DF = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3M is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers. TSM-DS3M was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3M was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
Additional Information
| TSM-DS3M |
| 2.94 +/- 0.04 |
| 0.0014 |
| Download (327.51KB) |
| Download (0.97MB) |
Description
- Dimensionally stable low loss laminate
Benefits
- Industry best DF (DF: 0.0011 @ 10GHz)
- High thermal conductivity
- Low Z axis expansion for avionics and aerospace applications
- Low (~5 %) fiberglass content
- Dimensional stability rivals epoxy
- Enables large format high layer count PWBs
- Builds complex PWBs in yield with consistency and predictability
- Temperature stable DK +/- 0.25 (-30 °C to 120 °C)
- Compatible with resistive foils
Application
- Microstrip and stripline circuitry for avionics and aerospace applications
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antenna
- Oil Drilling
- Semiconductor / ATE Testing