Solutions » fastRise TC
The AGC Solution Guide lets you choose the most suitable product for your intended application.
Non-reinforced resin system for Indestructible Stacked Microvias
fastRise™ TC is a free standing, non-reinforced resin system designed with extremely low X, Y, Z thermal expansion. fastRise™ TC is a higher DK, non-flame retarded build-up film. fastRise™ TC has a coefficient of thermal expansion from 16 ~ 22 ppm/°C over the temperature range from 30°C to 260°C. This build-up film is close to the thermal expansion rates of copper (18 ppm/°C) and aluminum (24 ppm/°C) to minimize any stress that occurs during temperature excursions caused by the mismatched expansion rates of the metal and the dielectric material. fastRise™ TC was designed to meet the current and future needs of: High density (HDI) laser formed interconnects, applications requiring critical thermal reliability such as space and avionics, and applications in need of thermal conductivity to spread heat away from hot spots.
Additional Information
| fastRise TC |
| 4.80 |
| 0.0023 |
| Download (1.09MB) |
| Download (924.64KB) |
Description
- Non-reinforced resin system for Indestructible Stacked Microvias
Benefits
- Passes 200 reflow cycles 35-260 °C
- Low ~ 22 ppm/°C expansion closely matched to copper and aluminum
- Low modulus, surface conformal layer to prevent pad cratering
- High 0.94 W/M*K thermal conductivity
- High flow and fill for sequential lamination and filling layers of heavy copper.
Application
- Semiconductor pin routing (HDI)
- Power Amplifiers
- Aviation
- Space
- Military